Invention Grant
- Patent Title: Wafer cassette packing apparatus
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Application No.: US16547856Application Date: 2019-08-22
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Publication No.: US11569106B2Publication Date: 2023-01-31
- Inventor: Tae Ju Yun , Chi Bok Lee
- Applicant: SK SILTRON CO., LTD.
- Applicant Address: KR Gumi-si
- Assignee: SK SILTRON CO., LTD.
- Current Assignee: SK SILTRON CO., LTD.
- Current Assignee Address: KR Gumi-si
- Agency: KED & Associates, LLP
- Priority: KR10-2019-0002634 20190109
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/673 ; H01L21/677

Abstract:
The present invention provides an apparatus for packing wafer cassettes, the apparatus including: a loading part to which a wafer cassette is loaded; an accessory inspecting part configured to check a recipe attached to the wafer cassette and inspect accessories of the wafer cassette; a first label attaching part configured to attach a first label to the wafer cassette on which the accessory inspection has been completed; a primary film packing part configured to receive a primary film according to the recipe and pack the wafer cassette using the primary film; a secondary film packing part configured to receive a secondary film according to the recipe and secondarily pack the wafer cassette using the secondary film; a second label attaching part configured to attach a second label to the secondary film with which the wafer cassette has been packed; and an unloading part configured to discharge the wafer cassette which has been completely packaged.
Public/Granted literature
- US20200219741A1 WAFER CASSETTE PACKING APPARATUS Public/Granted day:2020-07-09
Information query
IPC分类: