A multi-feed packaged antenna based on fan-out package, which relates to packaged antennas. A first passivation layer is arranged under a packaging layer, and first and second redistribution layers are arranged on the first passivation layer to build the multi-feed packaged antenna. Connecting ends of multiple channels of a chip are connected to a feed structure of a packaged antenna. A metal layer of the feed structure is achieved by the first redistribution layer, and the second redistribution layer is mainly configured to package an antenna. The coaxial feed is adopted herein, in which two redistribution layers are provided, by which a multi-port power combining can be achieved on the antenna, providing a wide-beam performance.