Invention Grant
- Patent Title: Semiconductor structure
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Application No.: US17336024Application Date: 2021-06-01
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Publication No.: US11569296B2Publication Date: 2023-01-31
- Inventor: Chern-Yow Hsu , Yuan-Tai Tseng , Shih-Chang Liu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT Law
- Agent Anthony King
- Main IPC: H01L27/22
- IPC: H01L27/22 ; H01L43/02 ; H01L43/08 ; H01L43/10 ; H01L23/522 ; H01L43/12

Abstract:
The present disclosure provides a semiconductor structure. The semiconductor structure includes a transistor layer, a memory region over the transistor layer, and a logic region adjacent to the memory region. The memory region includes a first Nth metal line, a magnetic tunneling junction (MTJ) over the first Nth metal line, a cap over the MTJ, a first stop layer on the cap, and a first (N+1)th metal via over the MTJ. The first (N+1)th metal via is laterally surrounded by the cap and the first stop layer. The logic region includes a second Nth metal line, a second stop layer over an (N+1)th metal line, and a second (N+1)th metal via over the (N+1)th metal line. N is an integer greater than or equal to 1.
Public/Granted literature
- US20210296395A1 SEMICONDUCTOR STRUCTURE Public/Granted day:2021-09-23
Information query
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