Invention Grant
- Patent Title: Silicon carbide semiconductor device and method of manufacturing silicon carbide semiconductor device
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Application No.: US16983558Application Date: 2020-08-03
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Publication No.: US11569376B2Publication Date: 2023-01-31
- Inventor: Akimasa Kinoshita
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Priority: JPJP2019-163386 20190906
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/16 ; H01L21/04 ; H01L29/66 ; H01L29/10

Abstract:
First p+-type regions are provided directly beneath trenches, separate from a p-type base region and facing bottoms of the trenches in a depth direction. The first p+-type regions are exposed at the bottoms of the trenches and are in contact with a gate insulating film at the bottoms of the trenches. Second p+-type regions are each provided between (mesa region) adjacent trenches, separate from the first p+-type regions and the trenches. Drain-side edges of the second p+-type regions are positioned closer to a source side than are drain-side edges of the first p+-type regions. In each mesa region, an n+-type region is provided separate from the first p+-type regions and the trenches. The n+-type regions are adjacent to and face the second p+-type regions in the depth direction.
Public/Granted literature
- US20210074849A1 SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2021-03-11
Information query
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