Invention Grant
- Patent Title: Solid electrolyte integrated device, method of manufacturing solid electrolyte integrated device, and solid electrolyte element
-
Application No.: US16604182Application Date: 2018-04-03
-
Publication No.: US11569528B2Publication Date: 2023-01-31
- Inventor: Shingo Ide , Isamu Yashima , Kenji Kume
- Applicant: MITSUI MINING & SMELTING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUI MINING & SMELTING CO., LTD.
- Current Assignee: MITSUI MINING & SMELTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Marshall, Gerstein & Borun LLP
- Priority: JPPCT/JP2017/014709 20170410
- International Application: PCT/JP2018/014331 WO 20180403
- International Announcement: WO2018/190205 WO 20181018
- Main IPC: H01M10/0562
- IPC: H01M10/0562 ; C25B9/23 ; C25B1/02

Abstract:
In a solid electrolyte integrated device including a substrate with electrically insulated surfaces, a first lower electrode layer and a second upper electrode layer are electrically connected to each other on a first main surface side, and a first upper electrode layer, the first lower electrode layer, the second upper electrode layer, and a second lower electrode layer transmit ions and/or have ion redox ability, contain a metal or a metal oxide or both of a metal and a metal oxide, and have a permeable portion.
Public/Granted literature
Information query