Invention Grant
- Patent Title: Laser apparatus
-
Application No.: US17267665Application Date: 2019-11-20
-
Publication No.: US11569630B2Publication Date: 2023-01-31
- Inventor: Koichi Hamamoto
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPJP2019-033984 20190227
- International Application: PCT/JP2019/045479 WO 20191120
- International Announcement: WO2020/174779 WO 20200903
- Main IPC: H01S3/042
- IPC: H01S3/042 ; H01S3/04 ; H01S3/06 ; H01S3/094 ; H01S3/16 ; H01S3/08

Abstract:
A laser apparatus that can generate a high-quality laser beam is provided. The laser apparatus is provided with a laser medium and an insulation layer. The laser medium has a first surface and a second surface. Incident laser light is incident on the first surface. The second surface totally reflects the incident laser light that is incident to the second surface at an incident angle equal to or larger than a critical angle. The insulation layer covers a second area of the second surface that surrounds a first area of the second surface, the first area totally reflecting the incident laser light. The laser medium is exposed in the first area.
Public/Granted literature
- US20210203118A1 LASER APPARATUS Public/Granted day:2021-07-01
Information query