Invention Grant
- Patent Title: Photodiode package structure with shutters, forming method thereof, and wearable device having the same
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Application No.: US17037738Application Date: 2020-09-30
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Publication No.: US11570339B2Publication Date: 2023-01-31
- Inventor: Kai-Hung Cheng , Fu-Han Ho
- Applicant: Lextar Electronics Corporation
- Applicant Address: TW Hsinchu
- Assignee: Lextar Electronics Corporation
- Current Assignee: Lextar Electronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: CKC & Partners Co., LLC
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L31/18 ; H01L31/0203 ; H01L31/0232 ; H04N5/225
Abstract:
According to the disclosure, a photodiode package structure is provided. The photodiode package structure includes a substrate, a photodiode chip on the substrate, a plurality of shutters above the photodiode chip, and a seal member covering the substrate and the photodiode chip, in which the shutters are embedded in the seal member.
Public/Granted literature
- US20220103726A1 PHOTODIODE PACKAGE STRUCTURE, METHOD OF FORMING THE SAME, AND WEARABLE DEVICE Public/Granted day:2022-03-31
Information query
IPC分类:
