Invention Grant
- Patent Title: Speaker configuration and housing
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Application No.: US17488862Application Date: 2021-09-29
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Publication No.: US11570531B2Publication Date: 2023-01-31
- Inventor: Wim Willy J. Corten , Christopher Matthew Barrow , Jake Chervin , Matthew Dore , Tok Doun , Johan Frits Ploeg
- Applicant: Biamp Systems, LLC
- Applicant Address: US OR Beaverton
- Assignee: Biamp Systems, LLC
- Current Assignee: Biamp Systems, LLC
- Current Assignee Address: US OR Beaverton
- Main IPC: H04R1/02
- IPC: H04R1/02

Abstract:
An example apparatus includes a speaker housing with a recessed portion having a spring-loaded lip and a set of leads to provide power to the speaker when connected to a lead, and a lead interface plate external to the speaker housing with a set of leads to match the leads in the speaker housing, and when press-fitted into the recessed portion, provides a locked position with one side of the lead interface plate secured in front of the spring-loaded lip.
Public/Granted literature
- US20220232302A1 SPEAKER CONFIGURATION AND HOUSING Public/Granted day:2022-07-21
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