Invention Grant
- Patent Title: Lead cutting system
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Application No.: US16982736Application Date: 2018-03-26
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Publication No.: US11570939B2Publication Date: 2023-01-31
- Inventor: Kazuya Degura
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2018/011972 WO 20180326
- International Announcement: WO2019/186613 WO 20191003
- Main IPC: H05K13/04
- IPC: H05K13/04 ; H05K13/00

Abstract:
A lead-cutting system, comprising: a rotation device configured to rotate a rotary table; a cutting device, being disposed on the rotary table, which is configured to cut leads of a lead component inserted into through-holes in a board; and a container, being disposed on the rotary table together with the cutting device, which contains leads cut by the cutting device.
Public/Granted literature
- US20210007254A1 LEAD-CUTTING SYSTEM, AND LEAD COMPONENT INSTALLATION SYSTEM Public/Granted day:2021-01-07
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