Invention Grant
- Patent Title: Component feeding device and component feeding method
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Application No.: US16768787Application Date: 2017-12-12
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Publication No.: US11570941B2Publication Date: 2023-01-31
- Inventor: Shinya Terasawa
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2017/044519 WO 20171212
- International Announcement: WO2019/116442 WO 20190620
- Main IPC: H05K13/08
- IPC: H05K13/08 ; B65G47/14 ; B65G47/91 ; H05K13/02 ; H05K13/04

Abstract:
There is provided a component feeding device including multiple component replenishing devices configured to replenish with components having different shapes; multiple stages on which the components replenished from the multiple replenishing devices are scattered, and a control section configured to cause the multiple replenishing devices to replenish the components to the respective stages at an arbitrary timing. There is provided a component feeding method for supplying components, having different shapes and being respectively replenished onto multiple stages from multiple replenishing devices, to a component mounting device with the components being respectively scattered on the multiple stages, wherein amounts of the components is capable of being respectively changed for each of the multiple stages.
Public/Granted literature
- US20210176906A1 COMPONENT FEEDING DEVICE AND COMPONENT FEEDING METHOD Public/Granted day:2021-06-10
Information query