Invention Grant
- Patent Title: Binding machine
-
Application No.: US16815484Application Date: 2020-03-11
-
Publication No.: US11571733B2Publication Date: 2023-02-07
- Inventor: Yusuke Yoshida , Kenichi Arai , Takahiro Ito , Shigeki Shindou
- Applicant: MAX CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: MAX CO., LTD.
- Current Assignee: MAX CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Weihrouch IP
- Priority: JPJP2019-044291 20190311,JPJP2019-103942 20190603
- Main IPC: B21F15/04
- IPC: B21F15/04

Abstract:
A binding machine includes a wire feeding unit configured to feed two wires to be wound on an object to be bound, a wire guide configured to align the two wires in parallel, a binding unit having an engaging member in which the wires are to be engaged, and the binding unit configured to twist the wires which are wound on the object to be bound and which are engaged in the engaging member, a curl guide configured to curl the wires being fed by the wire feeding unit into a loop shape, an inductive guide configured to guide the wires curled by the curl guide toward the binding unit, and a parallel alignment regulation part configured to guide an alignment direction of the two wires to be engaged with the engaging member in a radial direction of the loop.
Public/Granted literature
- US20200290109A1 BINDING MACHINE Public/Granted day:2020-09-17
Information query