Invention Grant
- Patent Title: Soldering flux and soldering paste
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Application No.: US16630250Application Date: 2018-07-09
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Publication No.: US11571771B2Publication Date: 2023-02-07
- Inventor: Kazuya Kitazawa , Takayuki Kobayashi , Yusuke Kawano
- Applicant: Senju Metal Industry Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Senju Metal Industry Co., Ltd.
- Current Assignee: Senju Metal Industry Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: The Webb Law Firm
- Priority: JPJP2017-136138 20170712
- International Application: PCT/JP2018/025860 WO 20180709
- International Announcement: WO2019/013158 WO 20190117
- Main IPC: B23K35/362
- IPC: B23K35/362 ; B23K35/02

Abstract:
If a flux contains an amount of thixotropic agent necessary for obtaining the effect of suppressing a heating sagging, the amount of flux residue increases, and, if applied for uses that do not involve washing, a large amount of flux residue derived from the thixotropic agent remains around the soldered portions, thereby affecting chemical and electrical reliability; and that washing performance is poor in uses involving washing of the flux residue. Accordingly, this soldering flux contains nanofibers of one or more kinds from among polysaccharides, modified polysaccharides, and incompletely modified polysaccharides being modified from polysaccharides into modified polysaccharides, by an amount of 50 wt ppm or more and 3000 wt ppm or less with respect to a total amount of flux.
Public/Granted literature
- US2647897A Method of producing a crystalline mixture of hexamethylenetetramine thiocyanic acid and ammonium sulphate Public/Granted day:1953-08-04
Information query
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