Invention Grant
- Patent Title: Machining apparatus
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Application No.: US17245410Application Date: 2021-04-30
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Publication No.: US11571777B2Publication Date: 2023-02-07
- Inventor: Hiroki Haremaki , Yoshiteru Kawamori , Taiki Matsui
- Applicant: SUGINO MACHINE LIMITED
- Applicant Address: JP Uozu
- Assignee: SUGINO MACHINE LIMITED
- Current Assignee: SUGINO MACHINE LIMITED
- Current Assignee Address: JP Uozu
- Agency: United IP Counselors, LLC
- Priority: JPJP2020-100624 20200610,JPJP2021-011905 20210128
- Main IPC: B23Q11/08
- IPC: B23Q11/08

Abstract:
The machining apparatus includes: a cover including a side plate, a projecting portion disposed below the side plate, a rectangular shaped front opening, and a semicircular shaped planar opening; a first door body including a first drum disposed in a first side of a mating surface, a first abutting surface connected to the first drum, and a first top plate, and accommodated inside the cover by rotated about a first axis; and a second door body including a second drum disposed in the second side of the mating surface, a second abutting surface abut to the first abutting surface on the mating surface, and a second top plate, and accommodated inside the cover by rotated about a second axis.
Public/Granted literature
- US20210387299A1 MACHINING APPARATUS Public/Granted day:2021-12-16
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