Invention Grant
- Patent Title: Injection molding device, injection molding system, and three-dimensional shaping device
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Application No.: US17070272Application Date: 2020-10-14
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Publication No.: US11571844B2Publication Date: 2023-02-07
- Inventor: Kakeru Sasagawa , Kei Yokota , Kenta Anegawa , Seiichiro Yamashita , Yuji Shinbaru , Kazunobu Maruyama , Daichi Miyashita
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JPJP2019-190023 20191017
- Main IPC: B29C45/72
- IPC: B29C45/72 ; B33Y30/00 ; B29C45/03 ; B29C45/42 ; B29C64/295 ; B29C45/00

Abstract:
An injection molding device includes: a material storage unit storing a material; a drive motor; a plasticization unit including a rotor that rotates by rotation of the drive motor, a barrel facing the rotor, and a heater, and configured to plasticize and flow out the material supplied from the material storage unit; a nozzle through which the material after plasticization is injected toward a mold from the plasticization unit; and a material drying unit configured to collect waste heat of the drive motor and dry the material in the material storage unit.
Public/Granted literature
- US20210114274A1 INJECTION MOLDING DEVICE, INJECTION MOLDING SYSTEM, AND THREE-DIMENSIONAL SHAPING DEVICE Public/Granted day:2021-04-22
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