Invention Grant
- Patent Title: Multi-chip module (MCM) assembly and a printing bar
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Application No.: US17265039Application Date: 2019-07-18
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Publication No.: US11571894B2Publication Date: 2023-02-07
- Inventor: Silvano Tori , Tazio Sandri , Marco Sarti , Lucia Giovanola
- Applicant: SICPA HOLDING SA
- Applicant Address: CH Prilly
- Assignee: SICPA HOLDING SA
- Current Assignee: SICPA HOLDING SA
- Current Assignee Address: CH Prilly
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: EP18186258 20180730
- International Application: PCT/EP2019/069426 WO 20190718
- International Announcement: WO2020/025348 WO 20200206
- Main IPC: B41J2/155
- IPC: B41J2/155 ; B41J2/14
Abstract:
A multi-chip module (MCM) assembly comprising: a graphite substrate comprising a plurality of silicon chips directly attached to the graphite substrate, and a Printed Wiring Board (PWB) attached to the graphite substrate by means of a solvent-resistant adhesive glue and provided with openings surrounding outer profiles of the silicon chips. A printing bar comprising a plurality of the MCM assemblies is also disclosed.
Public/Granted literature
- US20210379891A1 A MULTI-CHIP MODULE (MCM) ASSEMBLY AND A PRINTING BAR Public/Granted day:2021-12-09
Information query
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