- Patent Title: Resin composition for acoustic matching layer, cured product, acoustic matching sheet, acoustic probe, acoustic measuring apparatus, method for producing acoustic probe, and acoustic matching layer material set
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Application No.: US16863365Application Date: 2020-04-30
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Publication No.: US11572467B2Publication Date: 2023-02-07
- Inventor: Yoshihiro Nakai , Kazuhiro Hamada
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2017-212210 20171101
- Main IPC: G01N29/24
- IPC: G01N29/24 ; G10K11/36 ; C08G59/24 ; C08G59/32 ; C08G59/66 ; C08L63/04 ; C08G59/06 ; C08L63/02 ; C08K3/011 ; C08K3/08 ; C08K5/37

Abstract:
Provided is a resin composition for an acoustic matching layer, the resin composition including metal particles (A), an epoxy resin (B), a polythiol compound (C), and a cure-accelerating compound (D). The epoxy resin (B) includes at least one epoxy resin selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins, and the polythiol compound (C) includes a compound having at least two specific partial structures. Also provided are a cured product formed of the composition, an acoustic matching sheet, an acoustic probe, an acoustic measuring apparatus, and a method for producing an acoustic probe. Further provided is an acoustic matching layer material set suitable for preparation of the composition.
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