Invention Grant
- Patent Title: Conductive composition and production method therefor, and water-soluble polymer and production method therefor
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Application No.: US16931635Application Date: 2020-07-17
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Publication No.: US11572479B2Publication Date: 2023-02-07
- Inventor: Saki Makigawa , Shinji Saiki , Yoshiko Irie , Masashi Uzawa , Akira Yamazaki
- Applicant: Mitsubishi Chemical Corporation
- Applicant Address: JP Chiyoda-ku
- Assignee: Mitsubishi Chemical Corporation
- Current Assignee: Mitsubishi Chemical Corporation
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2018-011446 20180126
- Main IPC: C09D5/24
- IPC: C09D5/24 ; C09D7/65 ; C08F26/10 ; C09D179/02 ; G03F7/11 ; H01B1/12

Abstract:
A conductive composition comprising a conductive polymer (A), a water-soluble polymer (B), and a solvent (C1), wherein: the water-soluble polymer (B) comprises a water-soluble polymer (B11) represented by formula (11), and an amount of a water-soluble polymer (B2) represented by formula (2) as the water-soluble polymer (B) is 0.15% by mass or less, based on a total mass of the conductive composition: wherein R1 denotes a linear or branched alkyl group with 6 to 20 carbon atoms, each of R4 and R5 independently denotes a methyl or ethyl group, R6 denotes a hydrophilic group, R7 denotes a hydrogen atom or a methyl group, Y1 denotes a single bond, —S—, —S(═O)—, —C(═O)—O— or —O—, Z denotes a cyano group or a hydroxy group, each of p1 and q denotes an average number of repetitions, and is a number of from 1 to 50, and m denotes a number of from 1 to 5.
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