Invention Grant
- Patent Title: Adhesive for heat press molding, wooden board, and manufacturing methods thereof
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Application No.: US16486829Application Date: 2018-02-15
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Publication No.: US11572491B2Publication Date: 2023-02-07
- Inventor: Shigeki Naito , Yoshio Ueyama
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: JPJP2017-033854 20170224,JPJP2017-120628 20170620
- International Application: PCT/JP2018/005174 WO 20180215
- International Announcement: WO2018/155292 WO 20180830
- Main IPC: C09J7/00
- IPC: C09J7/00 ; C09J7/35 ; C09J7/38 ; B27N3/02 ; B27N3/08 ; C09J105/00 ; C09J201/08 ; C08K5/092 ; C08K5/19 ; C08L71/02 ; C08L91/06 ; D21J1/04 ; C08L97/02 ; C09J11/04 ; B27N3/00 ; C09J11/08
Abstract:
An adhesive for heat press molding contains a reaction product obtained by heat treatment on a mixture containing a polycarboxylic acid and a saccharide.
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