Invention Grant
- Patent Title: Adhesive composition
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Application No.: US16317312Application Date: 2017-07-13
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Publication No.: US11572493B2Publication Date: 2023-02-07
- Inventor: Atsushi Uno
- Applicant: Sunstar Engineering Inc.
- Applicant Address: JP Osaka
- Assignee: Sunstar Engineering Inc.
- Current Assignee: Sunstar Engineering Inc.
- Current Assignee Address: JP Osaka
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: JPJP2016-139524 20160714
- International Application: PCT/JP2017/025565 WO 20170713
- International Announcement: WO2018/012593 WO 20180118
- Main IPC: C09J123/20
- IPC: C09J123/20 ; C09J11/08 ; C09J145/00 ; C09J123/12 ; C09J123/08 ; C09J123/00
Abstract:
The present invention provides a hot-melt adhesive having a sufficiently long usable time and exhibiting good strength and good heat resistance. The present invention relates to a hot-melt adhesive composition comprising a hydrocarbon cyclic polymer (A), an α-olefin polymer (C), and a tackifying resin (D).
Public/Granted literature
- US20190249042A1 ADHESIVE COMPOSITION Public/Granted day:2019-08-15
Information query
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