Invention Grant
- Patent Title: Radar based fill-level sensor
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Application No.: US15774347Application Date: 2016-11-03
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Publication No.: US11573115B2Publication Date: 2023-02-07
- Inventor: Winfried Mayer , Martin Hitzler , Christian Waldschmidt
- Applicant: Endress + Hauser SE + Co. KG
- Applicant Address: DE Maulburg
- Assignee: Endress + Hauser SE + Co. KG
- Current Assignee: Endress + Hauser SE + Co. KG
- Current Assignee Address: DE Maulburg
- Agency: Bacon & Thomas, PLLC
- Priority: DE102015119690.5 20151113
- International Application: PCT/EP2016/076562 WO 20161103
- International Announcement: WO2017/080908 WO 20170518
- Main IPC: G01F23/284
- IPC: G01F23/284 ; H01L21/48 ; H01L23/495 ; H01L23/66 ; H01P3/16 ; H01P7/10 ; H01P11/00 ; H01Q1/22

Abstract:
A radar based, fill-level sensor comprising at least one semiconductor element, including at least a semiconductor chip and a chip package, in which the at least one semiconductor chip is arranged, wherein the at least one semiconductor chip has at least one coupling element, which serves as a signal gate for electromagnetic waves, preferably in the millimeter wave region, characterized in that at least one first resonator structure is arranged on a surface portion of the chip package.
Public/Granted literature
- US20200249067A1 Radar Based Fill-Level Sensor Public/Granted day:2020-08-06
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