Invention Grant
- Patent Title: Photonic structure and method for forming the same
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Application No.: US17521055Application Date: 2021-11-08
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Publication No.: US11573373B2Publication Date: 2023-02-07
- Inventor: Chan-Hong Chern , Min-Hsiang Hsu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: G02B6/136
- IPC: G02B6/136 ; G02B6/122 ; G02B6/12

Abstract:
A photonic structure is provided. The photonic structure includes a first oxide layer in a semiconductor substrate, a second oxide layer over an upper surface of the semiconductor substrate and an upper surface of the first oxide layer, and an optical coupling region over an upper surface of the second oxide layer. The optical coupling region is made of silicon, and an area of the optical coupling region is confined within an area of the first oxide layer in a plan view.
Public/Granted literature
- US20220057577A1 PHOTONIC STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2022-02-24
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