Invention Grant
- Patent Title: Layer configuration prediction method and layer configuration prediction apparatus
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Application No.: US16831777Application Date: 2020-03-26
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Publication No.: US11573538B2Publication Date: 2023-02-07
- Inventor: Norimichi Tsumura , Junki Yoshii , Keita Hirai , Wataru Arai
- Applicant: MIMAKI ENGINEERING CO., LTD. , NATIONAL UNIVERSITY CORPORATION CHIBA UNIVERSITY
- Applicant Address: JP Nagano; JP Chiba
- Assignee: MIMAKI ENGINEERING CO., LTD.,NATIONAL UNIVERSITY CORPORATION CHIBA UNIVERSITY
- Current Assignee: MIMAKI ENGINEERING CO., LTD.,NATIONAL UNIVERSITY CORPORATION CHIBA UNIVERSITY
- Current Assignee Address: JP Nagano; JP Chiba
- Agency: JCIPRNET
- Priority: JPJP2019-063003 20190328
- Main IPC: B33Y10/00
- IPC: B33Y10/00 ; G05B13/02 ; B33Y50/02 ; B29C64/112 ; B29C64/393 ; G06N20/00 ; G06N5/04

Abstract:
A layer configuration prediction method is provided and includes: a specimen production step of producing multiple specimens by depositing layers of a material in configurations different from each other; a specimen measurement step of performing, on each specimen, measurement to acquire a texture parameter corresponding to a texture; a learning step of causing a computer to perform machine learning of a relation between each of the specimens and the texture parameter; a setting parameter calculation step of calculating a setting parameter corresponding to the texture set to a computer graphics image; and a layer configuration acquisition step of providing the setting parameter as an input to the computer having been caused to perform the machine learning, and acquiring an output representing the layering pattern of layers of the material corresponding to the setting parameter.
Public/Granted literature
- US20200310366A1 LAYER CONFIGURATION PREDICTION METHOD AND LAYER CONFIGURATION PREDICTION APPARATUS Public/Granted day:2020-10-01
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