Invention Grant
- Patent Title: Touchpad module of an information handling system
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Application No.: US17654464Application Date: 2022-03-11
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Publication No.: US11573645B1Publication Date: 2023-02-07
- Inventor: Yu-Feng Huang , Chun-Kai Tzeng , Chin-Chung Wu
- Applicant: Dell Products L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: McDermott Will & Emery LLP
- Main IPC: G06F3/02
- IPC: G06F3/02

Abstract:
A touchpad module including: a touchpad printed circuit board (PCB); a switch coupled to a first side of the touchpad PCB; a touchpad bracket, with at least a portion of the bracket spaced apart from the switch a first distance; a frame, with at least a segment of the frame positioned between the portion of the bracket and the switch, the segment of the frame including a through hole in superimposition with at least a portion of the switch; and a stopper positioned within the through hole and with a first end of the stopper in contact with the switch.
Information query