Invention Grant
- Patent Title: Storage system with interconnected solid state disks
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Application No.: US17220842Application Date: 2021-04-01
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Publication No.: US11573895B2Publication Date: 2023-02-07
- Inventor: Peng Li , Jawad B. Khan , Sanjeev N. Trika
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Compass IP Law PC
- Main IPC: G06F12/06
- IPC: G06F12/06 ; G11C7/10 ; G05B19/045 ; G06F3/06
Abstract:
An embodiment of a semiconductor package apparatus may include technology to provide a first interface between a first storage device and a host device, and provide a second interface directly between the first storage device and a second storage device. Other embodiments are disclosed and claimed.
Public/Granted literature
- US20210326254A1 STORAGE SYSTEM WITH INTERCONNECTED SOLID STATE DISKS Public/Granted day:2021-10-21
Information query
