Invention Grant
- Patent Title: Coil component
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Application No.: US15931161Application Date: 2020-05-13
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Publication No.: US11574763B2Publication Date: 2023-02-07
- Inventor: Kwang Il Park , In Suk Kim , Young Sun Kim , Sung Hee Kim , In Young Kang
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0136189 20191030
- Main IPC: H01F27/08
- IPC: H01F27/08 ; H01F27/29 ; H01F27/28 ; H01F41/04 ; H01F27/24

Abstract:
A coil component includes a body having both end surfaces opposing each other in a length direction; a support substrate disposed in the body; a coil portion disposed on the support substrate in a width direction of the body, and including first and second lead-out portions each exposed to a first surface and a second surface of the body opposing each other in a thickness direction of the body, respectively, and disposed on the support substrate; and first and second external electrodes disposed on the first surface of the body, spaced apart from each other, and connected to one ends of the first and second lead-out portions exposed to the first surface of the body, respectively.
Public/Granted literature
- US20210134509A1 COIL COMPONENT Public/Granted day:2021-05-06
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