Invention Grant
- Patent Title: Coil component
-
Application No.: US16294333Application Date: 2019-03-06
-
Publication No.: US11574767B2Publication Date: 2023-02-07
- Inventor: Kwang Il Park , Hye Yeon Cha , Young Sun Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0112737 20180920
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/29 ; H01F27/32

Abstract:
A coil component includes a body having one surface and another surface opposing each other in one direction, a plurality of walls each connecting the one surface to the other surface, and a coil portion disposed therein. A recess extends along at least portions of edges common to the one surface and to walls of the plurality of walls. A lower insulating layer is disposed in the recess and on the one surface. First and second external electrodes penetrate through the lower insulating layer, are spaced apart from each other on the one surface of the body, and are connected to the coil portion. A shielding layer is disposed on the other surface of the body and the plurality of walls of the body, and extends to the one surface of the body to be spaced apart from the first and second external electrodes.
Public/Granted literature
- US20200098508A1 COIL COMPONENT Public/Granted day:2020-03-26
Information query