Invention Grant
- Patent Title: Coil component
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Application No.: US16671043Application Date: 2019-10-31
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Publication No.: US11574768B2Publication Date: 2023-02-07
- Inventor: Dong Seob Lee , Jong Min Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0162903 20181217
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F3/08 ; H01F17/04 ; H01F27/29 ; H01F27/30 ; H01F41/04

Abstract:
A coil component includes a body having one surface and the other surface facing each other; an insulating substrate embedded in the body, and having one surface substantially perpendicular to the one surface of the body; a coil portion disposed on the one surface of the insulating substrate, and including a coil pattern layer having a coil pattern and a lead-out pattern extending from the coil pattern and exposed from the one surface of the body; an insulating layer disposed on the one surface of the insulating substrate to cover the coil pattern layer; and first and second external electrodes arranged to be spaced apart from each other on the one surface of the body and respectively connected to the lead-out pattern. A thickness of the lead-out pattern is greater than a thickness of the coil pattern, and less than a thickness of the insulating layer.
Information query