Invention Grant
- Patent Title: Multilayer electronic component
-
Application No.: US17490039Application Date: 2021-09-30
-
Publication No.: US11574773B2Publication Date: 2023-02-07
- Inventor: Young Soo Yi , Soung Jin Kim , Kun Hoi Koo , Jun Hyeon Kim , Kyung Ryul Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2020-0174342 20201214
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/30 ; H01G4/248

Abstract:
A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween; and an external electrode including a first electrode layer disposed externally on the body, connected to the internal electrodes, and including a conductive metal, a glass, a low melting point metal having a lower melting point than the conductive metal, and a pore, and a second electrode layer covering the first electrode layer and including a conductive metal, a glass, and a pore, wherein porosity of the first electrode layer is higher than porosity of the second electrode layer.
Public/Granted literature
- US20220189696A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2022-06-16
Information query