A multilayer electronic component includes a body including a plurality of dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connected to the first surface and the second surface and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other, a plurality of internal electrodes disposed inside of the body, exposed to the first surface and the second surface, and having one ends exposed to the third or fourth surfaces, side margin portions disposed on the first surface and the second surface, and external electrodes disposed on the third surface and the fourth surface. The side margin portions and the plurality of dielectric layers include a metal, and a total amount of the metal included in the side margin portions is greater than that of the plurality of dielectric layers.