Invention Grant
- Patent Title: Thermal cutoff
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Application No.: US17293032Application Date: 2019-09-20
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Publication No.: US11574787B2Publication Date: 2023-02-07
- Inventor: Yaoxiang Hong
- Applicant: XIAMEN SET ELECTRONICS CO., LTD
- Applicant Address: CN Xiamen
- Assignee: XIAMEN SET ELECTRONICS CO., LTD
- Current Assignee: XIAMEN SET ELECTRONICS CO., LTD
- Current Assignee Address: CN Xiamen
- Agency: Bayramoglu Law Offices LLC
- Priority: CN201920354461.7 20190320
- International Application: PCT/CN2019/106991 WO 20190920
- International Announcement: WO2020/186717 WO 20200924
- Main IPC: H01H85/08
- IPC: H01H85/08 ; H01H85/38 ; H01H85/048 ; H01H85/06 ; H01H85/143

Abstract:
A thermal cutoff at least includes a current-carrying fusible element having two ends connected to a first electrode and a second electrode. The current-carrying fusible element is provided in a closed cavity bounded by a housing having an opening at one end, a cover plate, and a sealant. The thermal cutoff further includes a first lead wire and a second lead wire each wrapped by an insulating sheath. One end of the first lead wire and one end of the second lead wire are electrically connected to the first electrode and the second electrode. The sealant is filled in the opening of the housing, covers an electrical joint between the first lead wire and a first electrode plate and an end of the first lead wire, and also covers an electrical joint between a second electrode plate and the second lead wire and an end of the second lead wire.
Public/Granted literature
- US20220005662A1 THERMAL CUTOFF Public/Granted day:2022-01-06
Information query
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