Invention Grant
- Patent Title: Workpiece processing and resin grinding apparatus
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Application No.: US16216394Application Date: 2018-12-11
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Publication No.: US11574804B2Publication Date: 2023-02-07
- Inventor: Shinya Watanabe , Ichiro Yamahata , Katsuhiko Suzuki
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain, Ltd.
- Priority: JPJP2017-253566 20171228
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/67 ; B24B7/22 ; B05C11/10 ; B24B49/12 ; B24B53/017 ; H01L21/78 ; H01L21/3105 ; H01L21/304 ; B24B41/00 ; B24B37/00 ; B24B49/04 ; B24B37/34 ; B24B49/02 ; B24B7/10 ; B24B37/08 ; B24B53/007 ; B24B49/03 ; B24B55/02 ; B05B3/00 ; B05C9/12

Abstract:
A processing apparatus used in processing a workpiece having a device in each of a plurality of regions that includes a chuck table holding the workpiece, positioning means positioning the workpiece before grinding, resin coating means including a rotatable spinner table for coating the workpiece with a resin, cleaning means, a grinding unit, and a transfer unit. The transfer unit includes a first transfer unit transferring the workpiece from the positioning means to the spinner table and from the spinner table to the chuck table, a second transfer unit transferring the workpiece from the chuck table to the cleaning means, and a front/back surface inversion transfer unit taking over the workpiece from the cleaning means to the second transfer unit.
Public/Granted literature
- US20190206673A1 WORKPIECE PROCESSING METHOD AND PROCESSING APPARATUS Public/Granted day:2019-07-04
Information query
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