Invention Grant
- Patent Title: Process for manufacturing transferable thin layer
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Application No.: US16764176Application Date: 2018-11-15
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Publication No.: US11574807B2Publication Date: 2023-02-07
- Inventor: Père Roca I Cabaroccas , Wanghua Chen , Romain Cariou
- Applicant: Centre national de la recherche scientifique , INSTITUT PHOTOVOLTAÏQUE D'ILE DE FRANCE (IPVF) , ECOLE POLYTECHNIQUE , L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE , TOTAL SA , ELECTRICITE DE FRANCE
- Applicant Address: FR Paris; FR Antony; FR Palaiseau; FR Paris; FR Courbevoie; FR Paris
- Assignee: Centre national de la recherche scientifique,INSTITUT PHOTOVOLTAÏQUE D'ILE DE FRANCE (IPVF),ECOLE POLYTECHNIQUE,L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE,TOTAL SA,ELECTRICITE DE FRANCE
- Current Assignee: Centre national de la recherche scientifique,INSTITUT PHOTOVOLTAÏQUE D'ILE DE FRANCE (IPVF),ECOLE POLYTECHNIQUE,L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE,TOTAL SA,ELECTRICITE DE FRANCE
- Current Assignee Address: FR Paris; FR Antony; FR Palaiseau; FR Paris; FR Courbevoie; FR Paris
- Agency: Troutman Pepper Hamilton Sanders LLP
- Priority: FR1760749 20171115
- International Application: PCT/EP2018/081461 WO 20181115
- International Announcement: WO2019/096947 WO 20190523
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/16

Abstract:
The invention relates to a process for the preparation of a semiconductor material comprising at least one entirely monocrystalline semiconductor layer, said process comprising the steps of preparation of the surface of a first substrate to receive a monocrystalline silicon layer; deposition by Plasma-Enhanced Chemical Vapor Deposition (PECVD) of a layer of monocrystalline silicon by epitaxial growth with a growth rate gradient on the silicon layer monocrystalline obtained in step (i); and epitaxial growth of a monocrystalline layer of a semiconductor material on the monocrystalline silicon layer obtained in step (ii), to thus obtain a material comprising at least one entirely monocrystalline semiconductor layer. The invention also relates to a multilayer material comprising a monocrystalline layer of semiconductor material.
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