Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US16641713Application Date: 2018-08-17
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Publication No.: US11574827B2Publication Date: 2023-02-07
- Inventor: Tadashi Iino , Yoshihiro Kai , Yoichi Tokunaga , Nobuhiro Ogata , Jiro Higashijima
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Venjuris, P.C.
- Priority: JPJP2017-164584 20170829
- International Application: PCT/JP2018/030547 WO 20180817
- International Announcement: WO2019/044548 WO 20190307
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/304 ; H01L21/306 ; H01L21/687
Abstract:
A substrate processing apparatus includes: a processing unit including a holder that holds a substrate and rotates the substrate, a nozzle that ejects a processing liquid, and a conductive piping unit that supplies the processing liquid to the nozzle; a controller that causes the processing unit to execute a liquid processing in which the substrate is processed by supplying the processing liquid from the nozzle to the substrate that is held and rotated by the holder, and a measuring unit that measures a flowing current generated by the processing liquid flowing through the piping unit. The controller monitors the liquid processing based on a measurement result by the measuring unit.
Information query
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