Invention Grant
- Patent Title: Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding
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Application No.: US16670023Application Date: 2019-10-31
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Publication No.: US11574835B2Publication Date: 2023-02-07
- Inventor: Bing Dang , Jeffrey D. Gelorme , John U. Knickerbocker
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Samuel Waldbaum
- Main IPC: H01L21/683
- IPC: H01L21/683 ; C08G59/06 ; C09J163/00 ; C09J171/00 ; C08L63/00 ; C08L71/00 ; H01L21/02 ; C08K3/04 ; C09J9/00
Abstract:
A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.
Public/Granted literature
- US20200083082A1 THERMOPLASTIC TEMPORARY ADHESIVE FOR SILICON HANDLER WITH INFRA-RED LASER WAFER DE-BONDING Public/Granted day:2020-03-12
Information query
IPC分类:
