Invention Grant
- Patent Title: Underfill injection for electronic devices
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Application No.: US17158159Application Date: 2021-01-26
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Publication No.: US11574848B2Publication Date: 2023-02-07
- Inventor: Akihiro Horibe , Kuniaki Sueoka
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Jeffrey M. Ingalls
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L23/16 ; H01L23/02 ; H01L21/54
Abstract:
A device for applying underfill material into a space between a substrate and a semiconductor chip is provided. The device includes a frame housing configured to cover at least an outer edge area of the semiconductor chip that is bonded to the substrate. The device also includes a sealant attached to the frame housing and configured to contact the outer edge area of the semiconductor chip. The device also includes an outlet made on the frame housing for evacuating the space; and an inlet made on the frame housing for injecting the underfill material to the space.
Public/Granted literature
- US20220238403A1 UNDERFILL INJECTION FOR ELECTRONIC DEVICES Public/Granted day:2022-07-28
Information query
IPC分类:
