Invention Grant
- Patent Title: Foil-based package with distance compensation
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Application No.: US16800932Application Date: 2020-02-25
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Publication No.: US11574858B2Publication Date: 2023-02-07
- Inventor: Erwin Yacoub-George , Waltraud Hell
- Applicant: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
- Applicant Address: DE Munich
- Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
- Current Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
- Current Assignee Address: DE Munich
- Agency: Perkins Coie LLP
- Agent Michael A. Glenn
- Priority: DE102019202715.6 20190228
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/18 ; H01L23/552 ; H01L23/31 ; H01L21/48 ; H01L21/56 ; H01L23/00
Abstract:
A foil-based package and a method for manufacturing a foil-based package includes, among other things, a first and a second foil substrate. An electronic component is arranged between the two foil substrates in a sandwich-like manner. Due to the component thickness, there is a distance difference between the two foil substrates between the mounting area of the component and ears outside of the mounting area. The foil-based package and the method provides means for reducing and/or compensating a distance difference between the first foil substrate and the second foil substrate caused by the component thickness.
Public/Granted literature
- US20200279801A1 FOIL-BASED PACKAGE WITH DISTANCE COMPENSATION Public/Granted day:2020-09-03
Information query
IPC分类:
