Invention Grant
- Patent Title: Semiconductor miniaturization through component placement on stepped stiffener
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Application No.: US17088606Application Date: 2020-11-04
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Publication No.: US11574877B2Publication Date: 2023-02-07
- Inventor: Jenny Shio Yin Ong , Seok Ling Lim , Bok Eng Cheah , Jackson Chung Peng Kong
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Viering, Jentschura & Partner mbB
- Priority: MYPI2020004533 20200902
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/16 ; H01L21/48 ; H01L23/498
Abstract:
According to various examples, a device is described. The device may include a stiffener member including a first step section and a second step section. The device may also include a plurality of vias extending from or through the stiffener member. The device may be coupled to a printed circuit board.
Public/Granted literature
- US20220068841A1 STACKED SEMICONDUCTOR PACKAGE WITH STEPPED STIFFENER Public/Granted day:2022-03-03
Information query
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