Invention Grant
- Patent Title: Radio-frequency module and communication device
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Application No.: US17233542Application Date: 2021-04-19
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Publication No.: US11574898B2Publication Date: 2023-02-07
- Inventor: Satoshi Goto , Kazuhito Nakai
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Xsensus LLP
- Priority: JPJP2020-092582 20200527
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H04B1/40 ; H03F1/02 ; H01L25/16 ; H01L23/498 ; H03F3/20 ; H03F1/56

Abstract:
A radio-frequency module including a module substrate having a first main surface and a second main surface on opposite sides; a low-noise amplifier disposed on the second main surface; and a power amplifier circuit in a Doherty configuration. The power amplifier including a first phase circuit; a second phase circuit; a carrier amplifier disposed on the first main surface and including an input terminal connected to a first end of the first phase circuit and an output terminal connected to a first end of the second phase circuit; and a peaking amplifier disposed on the first main surface and including an input terminal connected to a second end of the first phase circuit and an output terminal connected to a second end of the second phase circuit.
Public/Granted literature
- US20210375838A1 RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE Public/Granted day:2021-12-02
Information query
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