Invention Grant
- Patent Title: Image sensor including transfer transistor having channel pattern on interlayered insulating layer over substrate and method of fabricating an image sensor
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Application No.: US16711301Application Date: 2019-12-11
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Publication No.: US11574948B2Publication Date: 2023-02-07
- Inventor: Changhwa Kim , Kwansik Kim , Dongchan Kim , Sang-Su Park , Beomsuk Lee , Taeyon Lee , Hajin Lim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2019-0063945 20190530
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L51/44 ; H01L29/786

Abstract:
An image sensor and a method of fabricating the image sensor, the image sensor including a semiconductor substrate having a first floating diffusion region, a molding pattern over the first floating diffusion region and including an opening, a first photoelectric conversion part at a surface of the semiconductor substrate, and a first transfer transistor connecting the first photoelectric conversion part to the first floating diffusion region. The first transfer transistor includes a channel pattern in the opening and a first transfer gate electrode. The channel pattern includes an oxide semiconductor. The channel pattern also includes a sidewall portion that covers a side surface of the opening, and a center portion that extends from the sidewall portion to a region over the first transfer gate electrode.
Public/Granted literature
- US20200381473A1 IMAGE SENSOR AND METHOD OF FABRICATING AN IMAGE SENSOR Public/Granted day:2020-12-03
Information query
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