Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17373660Application Date: 2021-07-12
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Publication No.: US11575001B2Publication Date: 2023-02-07
- Inventor: Tetsuo Takahashi , Hidenori Fujii , Shigeto Honda
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JPJP2020-167271 20201001
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L27/07 ; H01L29/861 ; H01L29/739

Abstract:
A semiconductor substrate has a transistor region, a diode region, and an outer peripheral region. The transistor region is divided into a plurality of transistor unit cell regions by a plurality of gate electrodes each having a stripe shape, and the diode region is divided into a plurality of diode unit cell regions by the plurality of gate electrodes. Each of the plurality of transistor unit cell regions has a third semiconductor layer of a first conductivity type provided on a first main surface side of the semiconductor substrate, a fourth semiconductor layer of a second conductivity type selectively provided on an upper layer part of the third semiconductor layer, and a fifth semiconductor layer. The fifth semiconductor layer is provided to be in contact with an impurity layer of the first conductivity type provided in the outer peripheral region, or to enter the impurity layer.
Public/Granted literature
- US20220109044A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-04-07
Information query
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