Invention Grant
- Patent Title: Van der Waals integration approach for material integration and device fabrication
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Application No.: US16982477Application Date: 2019-03-19
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Publication No.: US11575006B2Publication Date: 2023-02-07
- Inventor: Xiangfeng Duan , Yu Huang , Yuan Liu
- Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Applicant Address: US CA Oakland
- Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Current Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Current Assignee Address: US CA Oakland
- Agency: Foley & Lardner LLP
- International Application: PCT/US2019/022984 WO 20190319
- International Announcement: WO2019/183105 WO 20190926
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/66 ; H01L29/786 ; H01L51/05 ; H01L31/0352 ; H01L33/20
Abstract:
An electronic or optoelectronic device includes: (1) a layer of a first material; and (2) a layer of a second material disposed on the layer of the first material, wherein the first material is different from the second material, and the layer of the first material is spaced from the layer of the second material by a gap.
Public/Granted literature
- US20210020744A1 VAN DER WAALS INTEGRATION APPROACH FOR MATERIAL INTEGRATION AND DEVICE FABRICATION Public/Granted day:2021-01-21
Information query
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