Invention Grant
- Patent Title: Method of forming a bipolar transistor with a vertical collector contact
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Application No.: US16908117Application Date: 2020-06-22
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Publication No.: US11575020B2Publication Date: 2023-02-07
- Inventor: Miguel Urteaga , Andy Carter
- Applicant: Teledyne Scientific & Imaging, LLC
- Applicant Address: US CA Thousand Oaks
- Assignee: Teledyne Scientific & Imaging, LLC
- Current Assignee: Teledyne Scientific & Imaging, LLC
- Current Assignee Address: US CA Thousand Oaks
- Agency: M.J. Ram & Associates
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/66 ; H01L21/321 ; H01L21/8252

Abstract:
A method of forming a bipolar transistor with a vertical collector contact requires providing a transistor comprising a plurality of epitaxial semiconductor layers on a first substrate, and providing a host substrate. A metal collector contact is patterned on the top surface of the host substrate, and the plurality of epitaxial semiconductor layers is transferred from the first substrate onto the metal collector contact on the host substrate. The first substrate is suitably the growth substrate for the plurality of epitaxial semiconductor layers. The host substrate preferably has a higher thermal conductivity than does the first substrate, which improves the heat dissipation characteristics of the transistor and allows it to operate at higher power densities. A plurality of transistors may be transferred onto a common host substrate to form a multi-finger transistor.
Public/Granted literature
- US20210399115A1 METHOD OF FORMING A BIPOLAR TRANSISTOR WITH A VERTICAL COLLECTOR CONTACT Public/Granted day:2021-12-23
Information query
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