Invention Grant
- Patent Title: Method for fabricating a detection device comprising a step of direct bonding of a thin sealing layer provided with a getter material
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Application No.: US17105822Application Date: 2020-11-27
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Publication No.: US11575063B2Publication Date: 2023-02-07
- Inventor: Sébastien Becker , Frank Fournel
- Applicant: Commissariat à l'Energie Atomique et aux Energies Alternatives
- Applicant Address: FR Paris
- Assignee: Commissariat à l'Energie Atomique et aux Energies Alternatives
- Current Assignee: Commissariat à l'Energie Atomique et aux Energies Alternatives
- Current Assignee Address: FR Paris
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR1913325 20191127
- Main IPC: H01L31/18
- IPC: H01L31/18 ; H01L31/0203 ; H01L31/0216 ; H01L31/024 ; H01L31/09
Abstract:
The invention relates to a method for fabricating a thermal detector (1), comprising the following steps: forming a first stack (10), comprising a thermal detector (20), a mineral sacrificial layer (15) and a thin encapsulation layer (16) having a lateral vent (17.1); forming a second stack (30), comprising a thin sealing layer (33) and a getter portion (34); eliminating the mineral sacrificial layer (15); assembling by direct bonding the thin sealing layer (33), brought into contact with the thin encapsulation layer (16) and blocking the lateral vent (17.1), the getter portion (34) being located in the lateral vent (17.1).
Public/Granted literature
Information query
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