Invention Grant
- Patent Title: Separator and method for manufacturing thereof
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Application No.: US17160455Application Date: 2021-01-28
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Publication No.: US11575180B2Publication Date: 2023-02-07
- Inventor: Wei-Ting Yeh , Yi-Fang Huang , Kai-Wei Cheng , Yu-Ruei Li , Wan-Ting Lo
- Applicant: BenQ Materials Corporation
- Applicant Address: TW Taoyuan
- Assignee: BenQ Materials Corporation
- Current Assignee: BenQ Materials Corporation
- Current Assignee Address: TW Taoyuan
- Priority: TW109109188 20200319,TW109125863 20200730
- Main IPC: H01M50/451
- IPC: H01M50/451 ; H01M50/414 ; H01M50/409 ; H01M50/431 ; H01M50/403

Abstract:
The disclosure provides a separator comprising a porous substrate and a heat-resistant layer disposed on a surface of the substrate. The heat-resistant layer comprises a binder and a plurality of inorganic particles, wherein the heat-resistant layer is disposed on the surface of the porous substrate in the range of 10% to 90% of the total surface area of the porous substrate.
Public/Granted literature
- US20210296734A1 SEPARATOR AND METHOD FOR MANUFACTURING THEREOF Public/Granted day:2021-09-23
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