Invention Grant
- Patent Title: System and method for shielding attenuation of electromagnetic interference emissions
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Application No.: US17031505Application Date: 2020-09-24
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Publication No.: US11575211B2Publication Date: 2023-02-07
- Inventor: Sean D. Howard , Julie M. Byrd , Eric Stewart , Raymond Y. Zheng
- Applicant: Rockwell Collins, Inc.
- Applicant Address: US IA Cedar Rapids
- Assignee: Rockwell Collins, Inc.
- Current Assignee: Rockwell Collins, Inc.
- Current Assignee Address: US IA Cedar Rapids
- Agency: Suiter Swantz pc llo
- Main IPC: H01Q17/00
- IPC: H01Q17/00 ; H05K9/00 ; H05K1/02

Abstract:
A printed circuit board (PCB) module may include a PCB with at least one internal PCB element and at least one external PCB element, a shielding layer fabricated from a tunable metamaterial absorber, and a structure housing the PCB. The at least one internal PCB element may be embedded between adjacent layers of the PCB. The at least one external PCB element may be coupled to an exterior surface of the PCB. The shielding layer may be tuned in response to the at least one measurement of the EMI emission and a determination of a frequency of the EMI emission from the at least one measurement. The tuning of the shielding layer may include adjusting a plurality of fins within a plurality of elements of the metamaterial absorber to absorb at least a portion of the EMI emission.
Public/Granted literature
- US20220338343A1 SYSTEM AND METHOD FOR SHIELDING ATTENUATION OF ELECTROMAGNETIC INTERFERENCE EMISSIONS Public/Granted day:2022-10-20
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