Invention Grant
- Patent Title: Socket structure
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Application No.: US17318575Application Date: 2021-05-12
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Publication No.: US11575222B2Publication Date: 2023-02-07
- Inventor: Wei-Yao Chen
- Applicant: Delta Electronics, Inc.
- Applicant Address: TW Taoyuan
- Assignee: Delta Electronics, Inc.
- Current Assignee: Delta Electronics, Inc.
- Current Assignee Address: TW Taoyuan
- Agency: Kirton McConkie
- Agent Evan R. Witt
- Priority: CN202011150313.7 20201023
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/70 ; H01R12/71

Abstract:
A socket structure is provided and includes a circuit board, an insulating base, a pin and a conductive component. The insulating base is disposed on the circuit board and includes a first side and a second side opposite to each other. The pin is disposed between the first side and the second side. The conductive component is connected between the circuit board and the insulating base and includes a first arm, a second arm and a connecting part. The first arm and the second arm are connected to each other through the connecting part. The first arm is fixed on the second side of the insulating base and connected to the pin and includes a first fixing end connected to the circuit board. The second arm includes a second fixing end connected to the circuit board.
Public/Granted literature
- US20220131291A1 SOCKET STRUCTURE Public/Granted day:2022-04-28
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