Invention Grant
- Patent Title: Infrared image sensor and infrared camera module
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Application No.: US17341889Application Date: 2021-06-08
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Publication No.: US11575845B2Publication Date: 2023-02-07
- Inventor: Jung Eui Park , Do Hwan Kim , Seo Hyung Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2020-0139603 20201026
- Main IPC: H04N5/33
- IPC: H04N5/33 ; G01J5/0806 ; G01J5/08 ; G01J5/20 ; G01J5/00 ; H01L31/09

Abstract:
An infrared image sensor includes a first integrate circuit (IC), a bolometer disposed on or above one surface of the first IC configured to detect infrared rays passing through a lens module, a via electrically connecting the first IC and the bolometer, and a reflective layer disposed between the first IC and the bolometer, wherein the first IC includes at least one of a read-out (RO) element configured to perform analog processing for the bolometer to generate infrared sensing information and an image signal process (ISP) element configured to perform digital processing based on the bolometer to generate infrared image information, and at least one of an autofocusing (AF) control element and an optical image stabilization (OIS) control element configured to adjust a positional relationship between the lens module and the bolometer.
Public/Granted literature
- US20220132051A1 INFRARED IMAGE SENSOR AND INFRARED CAMERA MODULE Public/Granted day:2022-04-28
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