Invention Grant
- Patent Title: Intrinsic-stress self-compensated microelectromechanical systems transducer
-
Application No.: US17286302Application Date: 2019-11-26
-
Publication No.: US11575996B2Publication Date: 2023-02-07
- Inventor: Mohsin Nawaz , Shubham Shubham
- Applicant: Knowles Electronics, LLC
- Applicant Address: US IL Itasca
- Assignee: Knowles Electronics, LLC
- Current Assignee: Knowles Electronics, LLC
- Current Assignee Address: US IL Itasca
- Agency: Flener IP & Business Law
- Agent Zareefa B. Flener
- International Application: PCT/US2019/063247 WO 20191126
- International Announcement: WO2020/112769 WO 20200604
- Main IPC: H04R19/00
- IPC: H04R19/00 ; H04R19/04 ; B81B3/00 ; H04R7/16

Abstract:
A diaphragm for use in a transducer, the diaphragm including a flexible layer configured to deflect in response to changes in a differential pressure. The flexible layer includes a lattice grid. The lattice grid includes a first plurality of substantially elongate openings oriented along an axis and a second plurality of substantially elongate openings extending generally parallel to the axis. The second plurality of openings is substantially offset from the first plurality of openings in a direction substantially parallel to the axis. The first plurality of openings and the second plurality of openings define a first plurality of spaced apart grid beams extending between and substantially parallel to the axis and a second plurality of spaced apart grid beams extending substantially perpendicular to the axis. The second plurality of grid beams is configured to connect adjacent ones of the first plurality of grid beams.
Public/Granted literature
- US20210345046A1 INTRINSIC-STRESS SELF-COMPENSATED MICROELECTROMECHANICAL SYSTEMS TRANSDUCER Public/Granted day:2021-11-04
Information query