Invention Grant
- Patent Title: Cable substrate
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Application No.: US17199131Application Date: 2021-03-11
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Publication No.: US11576254B2Publication Date: 2023-02-07
- Inventor: Jung Soo Kim , Dae Jung Byun , Sang Hyun Sim , Chang Min Ha
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2020-0165927 20201201
- Main IPC: H05K1/02
- IPC: H05K1/02
Abstract:
A cable substrate includes an insulating layer, a slit portion penetrating through at least a portion of the insulating layer in a thickness direction of the insulating layer, and a dummy pattern disposed on the insulating layer. At least a portion of the dummy pattern is exposed to the slit portion.
Public/Granted literature
- US20220174812A1 CABLE SUBSTRATE Public/Granted day:2022-06-02
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