Invention Grant
- Patent Title: Circuit board
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Application No.: US17748300Application Date: 2022-05-19
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Publication No.: US11576257B2Publication Date: 2023-02-07
- Inventor: Wei-Liang Wu , Jia-He Li
- Applicant: Avary Holding (Shenzhen) Co., Limited. , QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD , GARUDA TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen; CN Huai an; TW New Taipei
- Assignee: Avary Holding (Shenzhen) Co., Limited.,QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD,GARUDA TECHNOLOGY CO., LTD.
- Current Assignee: Avary Holding (Shenzhen) Co., Limited.,QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD,GARUDA TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen; CN Huai an; TW New Taipei
- Agency: ScienBiziP, P.C.
- Priority: CN202011365023.4 20201127
- Main IPC: H05K1/02
- IPC: H05K1/02 ; G02B6/36 ; H05K1/11 ; H05K1/18 ; H05K3/34 ; H05K3/46

Abstract:
A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.
Public/Granted literature
- US20220279647A1 CIRCUIT BOARD Public/Granted day:2022-09-01
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